{"product_id":"chemistry-and-materials-science-9783319992563","title":"Chemistry and Materials Science","description":"\u003cp\u003eThis book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys.Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials;Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium;Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.\u003c\/p\u003e","brand":"Gardners","offers":[{"title":"Default Title","offer_id":52894884757783,"sku":null,"price":24228.47,"currency_code":"INR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0679\/6918\/8119\/files\/9783319992563.jpg?v=1781258137","url":"https:\/\/payment.letskitaboo.com\/te\/products\/chemistry-and-materials-science-9783319992563","provider":"Kitaboo One eStore","version":"1.0","type":"link"}