{"product_id":"research-on-chemical-mechanical-polishing-mechanism-of-novel-diffusion-barrier-ru-for-cu-interconnect-9789811061653","title":"Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect","description":"\u003cp\u003eThis thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu\/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.\u003c\/p\u003e","brand":"Gardners","offers":[{"title":"Default Title","offer_id":53644732858647,"sku":null,"price":11198.24,"currency_code":"INR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0679\/6918\/8119\/files\/9789811061653.jpg?v=1783500835","url":"https:\/\/payment.letskitaboo.com\/te\/products\/research-on-chemical-mechanical-polishing-mechanism-of-novel-diffusion-barrier-ru-for-cu-interconnect-9789811061653","provider":"Kitaboo One eStore","version":"1.0","type":"link"}