{"product_id":"handbook-of-wafer-bonding-9783527644230","title":"Handbook of Wafer Bonding","description":"\u003cp\u003eThe focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal\/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.\u003c\/p\u003e","brand":"Gardners","offers":[{"title":"Default Title","offer_id":53930099245335,"sku":null,"price":20287.92,"currency_code":"INR","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0679\/6918\/8119\/files\/9783527644230.jpg?v=1784110913","url":"https:\/\/payment.letskitaboo.com\/ur\/products\/handbook-of-wafer-bonding-9783527644230","provider":"Kitaboo One eStore","version":"1.0","type":"link"}